G1 1280 - Thermal Module

G1 adopts the LY infrared processing chip independently developed by InfiSense, equipped with a new self-developed 12µm 1280×1024 high-resolution VOx ceramic infrared detector. It can be flexibly connected to various intelligent processing platforms and can provide industry-leading ultra-high resolution to meet a variety of high-end imaging observation applications. Its high performance, small size,